| 摘要 |
PROBLEM TO BE SOLVED: To provide a visual inspection apparatus for a semiconductor package and its method for achieving accurate visual inspection and dispensing with later removal work, and for improving productivity in the semiconductor package by removing foreign matters adhering to diversified locations in the semiconductor package by using each kind of cleaning section at a stage before entering measurement. SOLUTION: The semiconductor package carried into the visual inspection apparatus 1 by a supply tray elevator 2 is taken out of a supply tray 3 by a carrying hand 4. The contaminations of the semiconductor package that has been taken out are removed by cleaning work using each cleaner hand 10 and by spraying ions by an ionizer 11 in a cleaning mechanism 5, and the removed contaminations are collected by a dust collector 12. Then, the contaminations are carried to a measurement section 6 for visual inspection, and a semiconductor package sorted to be conforming is stored in a storage tray 7, and is carried out to a next process outside the visual inspection apparatus 1 via a storage tray elevator 9. COPYRIGHT: (C)2006,JPO&NCIPI
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