发明名称 Circuit board with embedded component and method of manufacturing same
摘要 A circuit board has an embedded electronic component such as an integrated circuit chip with a wafer level chip size package. A via hole extends through the electronic component. Another via hole extends through the substrate or prepreg on which the electronic component is mounted inside the circuit board. Conductors in the via holes enable a terminal on the surface of the electronic component to be electrically connected to a wiring pattern or another electronic component on the opposite side of the substrate or prepreg. Routing the connection through the electronic component itself saves space and reduces the length of the connection.
申请公布号 US2006108144(A1) 申请公布日期 2006.05.25
申请号 US20050273339 申请日期 2005.11.15
申请人 SHIZUNO YOSHINORI 发明人 SHIZUNO YOSHINORI
分类号 H05K1/03 主分类号 H05K1/03
代理机构 代理人
主权项
地址