| 摘要 |
PROBLEM TO BE SOLVED: To provide a spring contact probe device advantageous in probing a high-density mounted semiconductor device or the like while simplifying the structure. SOLUTION: A probe pin 10 is passed through a probe support 20 having a guide plate 21 and a fixed plate 22 arranged with a space and mutually fixed, and one end of the probe pin 10 is supported slidably by the guide plate 21, so that the probe pin 10 can be distorted between the guide plate 21 and the fixed plate 22 to exhibit a predetermined elastic force when a contact part 13 exposed from the guide plate 21 is brought into contact with an inspection object. Accordingly, a spring contact probe device with an extremely easy structure can be provided without using other spring members such as a coil spring. COPYRIGHT: (C)2006,JPO&NCIPI
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