Package structure of memory card and packaging method for the structure

摘要

A package structure of a memory card includes a substrate. The substrate has connection pads on a first surface and conductive lead structures respectively coupled with the connection pads and extending to a second surface of the substrate. At least one chip is disposed over the substrate at the first surface. A plurality of bonding structures is respectively coupled between the conductive lead structures and the connection pads. A first packaging material layer with a desired thickness is formed on the substrate, wherein the first packaging material layer has an opening region not cover the chip and the bonding structures. A second packaging material layer with the same thickness as that of the first packaging material layer fills the opening region of the first packaging material layer. A packaging method for the memory card is also provided.