发明名称 |
Multilayered circuit substrate, semiconductor device and method of producing same |
摘要 |
A multi-layered circuit substrate for a semiconductor device comprises a multi-layered circuit substrate body having first and second surfaces and comprising a plurality of conductive pattern layers integrally laminated one on the other from the first surface to the second surface, so that a plurality of semiconductor device elements can be arranged on the first surface of the substrate body; and a plate member, a rigidity thereof being higher than that of the substrate body, attached to the second surface of the substrate body. A plurality of semiconductor elements can be mounted on the semiconductor element mounting surface defined on the first surface of the substrate body.
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申请公布号 |
US2006110838(A1) |
申请公布日期 |
2006.05.25 |
申请号 |
US20060324220 |
申请日期 |
2006.01.04 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
ROKUGAWA AKIO;IIJIMA TAKAHIRO |
分类号 |
H01L21/66;H01L23/12;H01L21/48;H01L21/68;H01L23/495;H01L25/065;H05K1/11;H05K3/00;H05K3/20;H05K3/32;H05K3/46 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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