发明名称 Method of forming ultra thin silicon oxynitride for gate dielectric applications
摘要 A method of forming a gate dielectric layer is disclosed. The method comprises the following steps. A substrate is provided having silicon regions containing surfaces upon which gate dielectrics are to be disposed. An oxide is formed over the surfaces. A silicon layer is formed over the oxide layer. A nitridation process is performed. An optional high temperature annealing step may be performed.
申请公布号 US2006110865(A1) 申请公布日期 2006.05.25
申请号 US20040992894 申请日期 2004.11.19
申请人 CHARTERED SEMICONDUCTOR MANUFACTURING LTD. 发明人 LIU JINPING;KOH HWA W.;SOHN DONG K.;HSIA LIANG C.
分类号 H01L21/84;H01L21/31 主分类号 H01L21/84
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