| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which the temperature of a semiconductor element can be detected more accurately by means of a temperature detection element. SOLUTION: The semiconductor device comprises a substrate 21, an inverter 14 mounted on the substrate 21, and a temperature detection element 17 arranged between the substrate 21 and the inverter 14 and detecting the temperature of the inverter 14. Furthermore, a heat transmission member such as a silicon sheet 23 or silicon grease 24 is arranged between the inverter 14 and the temperature detection element 17. COPYRIGHT: (C)2006,JPO&NCIPI |
