METHOD FOR MANUFACTURING LAMINATED TYPE ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of laminated type electronic components, where a so-called sheet attack phenomenon does not occur when forming an electrode pattern layer on the surface of a green sheet and the short-circuiting fraction defective is small.

SOLUTION: The manufacturing method of laminated type electronic components comprises a process for forming a first paste layer 100a on a support 20 by using paste for a first green sheet containing ceramic powder and first resin; a process for forming a second paste layer 100b on the first paste layer 100 a by using paste for a second green sheet containing the ceramic powder and second resin differing from the first one; a process for forming a cured lower green sheet 100 by allowing the first resin to react with the second one for curing; a process for forming the electrode pattern layer on the surface of the lower green sheet 100; and a process for baking a green chip having a laminate unit containing the lower green sheet 100 and the electrode pattern layer.

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