| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate having a through via penetrating a basic material and wiring being connected with the through via in which generation of void in the through via is suppressed and electrical connection reliability of the wiring and the through via can be enhanced, and to provide its production process. <P>SOLUTION: The through via 55 is constituted of a through portion 57, a wiring joint 56 provided at one end of the through portion 57 and wider than the diameter R1 at the through portion 57, and a connection pad 59 provided at the other end of the through portion 57 and wider than the diameter R1 at the through portion 57, and a conductive core material 58 located substantially on the central axis D of the through hole 52, and the through via 55 is formed by depositing conductive metal by using the conductive core material 58 as a power supply layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
