| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sensor system reduced in temperature drift for the sensor characteristics. <P>SOLUTION: The sensor system 101 is provided with the sensor device 10 and the integrated circuit 20 for driving the sensor device 10. The sensor device 10 comprises a sensor body 1 of silicon substrate, the upper sealed body 2 and the lower sealed body 3. The integrated circuit 20 is formed into a laminate, together with the sensor device 10. The sensor body 1 is connected with the wiring pattern 12 of the integrated circuit 20 through the electrode 5 for mounting provided on the through electrical path 4, passing the upper sealed body 2 and on the external surface of the upper sealed body 2. The sensor device 10 is connected with a MID substrate 30 through the integrated circuit 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
