SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND INSPECTION METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To enable a contact inspection for a semiconductor device which is more precise and can be performed using a simpler device compared with a non-contact inspection, despite the fact that it is difficult to perform the contact inspection in the case where interconnect lines are not exposed to the front surface if two chips are pasted together.

SOLUTION: For the purpose of forming an interconnect line to connect with a semiconductor film formed on a substrate through a release layer, an aperture region is formed so that the release layer may be exposed or it may stop just before exposure. After that, the interconnect line can be exposed, if the substrate is peeled. Then, it is possible to perform the contact inspection for chips.

COPYRIGHT: (C)2006,JPO&NCIPI