| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board superior in connection reliability which forms a high density fine wiring, without needing plated leads and controls the height of a circuit with high accuracy. SOLUTION: The method comprises a step (a) of boring a cupper-lined laminate board to form through holes therein, a step (b) of forming an electrolytic plating or electroless plating-acceptable layer on the inner walls of the holes being through-holes, a step (c) of selectively coating a plating resist, except for the inner walls of the holes being through-holes and their surrounding, a step (d) of forming nickel or its alloy plated layer on at least the holes inner walls by electrolytic or electroless plating, a step (e) of stripping the plated resist, a step (f) of protecting the plating layer on the through-holes inner walls and forming an etching resist for forming required wirings, a step (g) of selectively etching and removing cupper foil parts with no etching resist formed thereon, a step (h) of forming a protective film on the wiring surface and in the through-holes excepting the parts to be nickel plated and gold plated, and a step (i) of forming nickel and gold plating. COPYRIGHT: (C)2006,JPO&NCIPI
|
