| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition being excellent in adhesion to a stainless substrate, not causing environmental pollution and worsening of working environments because of its organic solvent content lowered by partial replacement with water, and therefore being advantageous in respect of safety and hygienics and to provide a coating material containing the same as a film-forming component. SOLUTION: The heat-resistant resin composition comprises (A) a polyamideimide resin comprising a diisocyanate compound and/or a diamine compound each having a structure of formula (I) (wherein R<SB>1</SB>and R<SB>2</SB>are each independently hydrogen or a monovalent organic group) and/or a polyamideimide resin comprising an acid anhydride and/or an acid anhydride chloride each having a structure of formula (II), (B) a basic compound, and (C) water. The coating material contains the same as a film-forming component. COPYRIGHT: (C)2006,JPO&NCIPI
|
