发明名称 Electrostatic discharge testing method and semiconductor device fabrication method
摘要 A method for determining a layout which passes testing for electrostatic discharge in a semiconductor device, includes extracting an electrostatic discharge protection network including pads, nets and protective elements; setting start pads and end pads in the electrostatic discharge protection network; finding inter-pad voltages between the start pads and the end pads and electrostatic discharge current paths from the start pads to the end pads; grouping together the electrostatic discharge current paths in the same order; calculating estimated values of electrostatic discharge withstand voltages between the start pads and the end pads and groups to which the start pads and the end pads belong using a negative correlation between the inter-pad voltages and corresponding electrostatic withstand voltages; and determining whether the layout passes testing regarding electrostatic discharge.
申请公布号 US2006109596(A1) 申请公布日期 2006.05.25
申请号 US20050243355 申请日期 2005.10.03
申请人 HAYASHI SACHIO 发明人 HAYASHI SACHIO
分类号 H02H9/00 主分类号 H02H9/00
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