| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transparent conductive film having good resistance to humidity and heat, excellent pen input resistance, suppressed crack generation at a punching process, and prevented generation of a swell or curl. <P>SOLUTION: The transparent base film has a hard coat layer on the one face thereof. An SiOx film having a thickness between 10nm and 300nm is formed on the hard coat layer. A transparent conductive layer having a thickness between 20 to 35nm is formed on the other surface of the transparent film base material. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
