| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe device, the inspecting method of the probe and the manufacturing method of a semiconductor device, capable of efficiently testing a semiconductor wafer requiring a plurality of temperature guarantees. SOLUTION: The probe device 10 is equipped with a probe card 11, a wafer transferring mechanism 12, an XY stage 13, chuck tables 14a, 14b, an alignment mechanism 15 and a control unit 16. The chuck tables 14a, 14b are the mounting regions of the semiconductor wafer and are capable of controlling the temperatures independently, respectively. Either the chuck tables 14a or 14b is introduced to a given position of the XY stage 13 in an inspection chamber 24, while the other one is left standing, until it is introduced into the XY stage 13 next, in turn. The standby chuck table 14a or 14b is received in a spare chamber 25a or the same 25b and a temperature atmosphere for the next inspection to come, is prepared. COPYRIGHT: (C)2006,JPO&NCIPI |
