发明名称 POLYAMIDE RESIN COMPOSITION AND POLYAMIDE FILM
摘要 PROBLEM TO BE SOLVED: To provide a polyamide composition, which has advantages of polyamides such as excellent tensile strength, mechanical characteristics including bending fatigue resistance, and a gas barrier property, hardly causes electrostatic adhesion of powder particles, dust and the like, and produces molded products such as a film continuously and effectively. SOLUTION: The polyamide resin composition comprises 20-100 wt.% of a semiaromatic polyamide component and 0-80 wt.% of an aliphatic polyamide, wherein (II-1) a polyamide elastomer composition (B) contains a specific amount of an electrolyte salt compound and a polyamide elastomer (C), (II-2) a polyamide elastomer (C) is a polyetheresteramide elastomer prepared from a polyamide hard segment (a) and a soft segment (b) and (II-5) a soft segment (b) contains a polyalkylene oxide with a specific structure having a number average molecular weight of 300-5,000. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006131890(A) 申请公布日期 2006.05.25
申请号 JP20050279298 申请日期 2005.09.27
申请人 UBE IND LTD 发明人 YAMAGUCHI YUTAKA;NAKAMURA KOJI
分类号 C08L77/00;B32B27/34;C08K3/00;C08L77/12 主分类号 C08L77/00
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