| 摘要 |
PROBLEM TO BE SOLVED: To provide a cylindrical magnetron sputtering system capable of improving the utilization efficiency of a target by reducing plasma damages in sputtering film deposition. SOLUTION: A cylindrical cathode electrode (including a target) is used, and a disk-shaped anode electrode and a ring-shaped magnet are smoothed. In addition, the electric field or the magnetic field is freely formed. COPYRIGHT: (C)2006,JPO&NCIPI
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