发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition having excellent moldability, providing a molded product having not only light weight, high rigidity and high heat resistance, but also excellent impact resistance, especially the impact resistance at low temperature. SOLUTION: The polyamide resin composition is obtained by dispersing silicate layers of swelling phyllosilicate at a molecular level in a polyamide resin, and satisfies the relation of Y≤X (with the provide that X and Y satisfy the relations of 2.5≤X≤4 and 2≤Y≤4) [wherein, X is a relative viscosity measured by using 98 mass% concentrated sulfuric acid as a solvent under the condition of 25°C temperature and 1 g/dl concentration; and Y (mass%) is the compounded proportion of the swelling phyllosilicate]. The resin composition preferably has≥4.5 J surface impact strength at -30°C,≥130°C load distortion temperature and≥4 GPa flexural modulus. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006131831(A) 申请公布日期 2006.05.25
申请号 JP20040325211 申请日期 2004.11.09
申请人 UNITIKA LTD 发明人 NEGI YUKINARI
分类号 C08L77/00;C08K3/34 主分类号 C08L77/00
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