| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor optical device for flip-chip bonding, in which the passive alignment is easy, and the aligning error can be minimized. SOLUTION: The method includes a step of sequentially stacking an active layer 220, a clad 230, and a mask in which an alignment pattern and an optical pattern are formed on a semiconductor substrate 210; a step of etching the active layer 220 and the clad 230 into a mesa structure by each pattern of the mask so as to have first and second alignment keys 280, 290a, 290b and an optical area 300; a step of growing at least two insulating layers 240, 250 at mesa-etched portions between the first and second alignment keys and the optical areas; and a step of forming protection masks on the first and second alignment keys 280, 290a, 290b, and growing an electrode 270 on the optical area 300 and the insulating layers 240, 250 except for the protection masks. COPYRIGHT: (C)2006,JPO&NCIPI
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