| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card and a wafer inspection device with which a proper electrical connection state is surely attained, even for a wafer of large area and a very small pitch of electrode to be inspected, position shift to the electrode to be inspected due to temperature variation is surely prevented and proper electrical connection state is maintained stably. SOLUTION: The inspection device comprises, on the surface of a metal-made frame plate, having a plurality of openings, a sheet-like probe whereon a plurality of contact films arranged with a plurality of electrode structures on a flexible insulation film are arranged to block the openings, a circuit substrate for inspection, where a plurality of inspection electrodes are formed on the surface; a plurality of support members having support pins for supporting the fringe of the sheet-like probe, and a heterogeneous conduction connectors arranged so that a plurality of elastic anisotropic conductive films block one opening individually on the frame plate, arranged in between the circuit substrate for inspection and the sheet-like probe and having a plurality of openings. The support pins in each of support members are provided, elastically displaceable in the thickness direction of the sheet-like probe. COPYRIGHT: (C)2006,JPO&NCIPI
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