| 摘要 |
An arrangement is provided for contacting an integrated circuit in a package by a contact plate arranged on a circuit carrier, wherein the package has contact locations on the contact plate side. In this context, the contact plate has contact vanes, which are formed such that they have a spring action directed normal to the circuit carrier and such that the contact vanes can be brought parallel to the circuit carrier by pressing the package against the contact vanes. The contact locations and contact vanes each establish an electrical connection with one another in the state in which they are pressed against the circuit carrier.
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