| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a module with a built-in electronic part with high reliability in a small size which can be used singly or by being stacked plurally, and to provide a method of simply manufacturing such a module with a built-in electronic part. <P>SOLUTION: The module with the built-in electronic part includes an insulting layer, a plurality of external terminals arranged so that the insulating layer may be penetrated, a wiring layer arranged in the insulating layer so that a desired external terminal may be connected, an electronic chip arranged on one surface of the insulating layer, an insulating resin layer arranged on the insulating layer so that this electronic part chip may be covered, and upper and lower conduction vias connected to the desired external terminal or the wiring layer through this insulating resin layer. The electronic chip has a thin film element forming layer formed on one surface of the silicon substrate, and the terminal of the thin film element forming layer is connected to the external terminal or the wiring layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
