| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device that, when plural light-emitting parts are monolithically formed on one substrate, has a high reliability, without the occurrence of the breakage etc. of a wiring, and a structure where, even if defects such as shortage occurs in a part of the plural light-emitting parts, the remaining parts can operate as light-emitting device. <P>SOLUTION: Plurality of light-emitting parts 1 are formed, by electrically isolating a semiconductor lamination 17 laminated so as to form light-emitting layer on a substrate 1, into plural pieces, and they are connected in series and parallel, respectively. The electrical isolation of the plurality of light-emitting parts 1 is formed by the isolation trenches 17a formed in the semiconductor lamination 17 and an insulating film 21 embedded in the isolation trenches 17a, the isolation trenches 17a are formed at positions, where the surfaces of the semiconductor laminations 17 sandwiching the isolation trenches 17a become substantially coplanar, and wiring films 3 are formed on the isolation trenches 17a via the insulating film 21. In addition, a fuse element is connected in series by each group of light-emitting parts connected in series. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
