| 摘要 |
PROBLEM TO BE SOLVED: To provide a functional thin film of high quality having reduced film defects such as pinholes and splashes at a high rate by preventing the bumping of an evaporation source material with simple apparatus and temperature control in a vapor deposition process for a functional thin film. SOLUTION: The method for depositing a functional thin film on a target member in a vacuum comprises: a first stage where a sealed space is formed inside a vacuum furnace and an evaporation source material is evaporated therein; and a second stage where the sealed space is provided with outlets, and reevaporation is performed, so as to deposit a functional thin film on the target member. In the first stage, the sealed space at the inside of the vacuum furnace is formed by packing holes made in a vessel where an evaporation source material is to be installed at the inside with an evaporated evaporation source material. In the second stage, the packed evaporation source material is heated and reevaporated, thus the sealed space is provided with the outlets. COPYRIGHT: (C)2006,JPO&NCIPI
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