| 摘要 |
The laminate-cutting method according to the present invention is a method for cutting an optical film wherein layers are laminated through a pressure-sensitive adhesive agent with a cutting edge, wherein the cutting of the laminate with the cutting edge is performed in the state that compressive stress applied to the optical film is decreased when the laminate is cut with the cutting edge. This makes it possible to provide a laminate-cutting method, a cutting device and a laminate-cutting pedestal wherein the generation of the adhesion of paste to a cutting edge, the blocking, cracking, chipping of cut faces, and others is prevented.
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