| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which contains a highly dispersed inorganic filler such as a metal hydroxide, has high heat resistance, does not contain a halogen, and has flame retardancy, and to provide a laminate and a printed wiring board each using the same. SOLUTION: This resin composition is characterized by containing (A) an epoxy resin, (B) a curing agent, (C) a metal hydroxide, (D) a silicone polymer having phenyl groups in the siloxane skeleton and having two or more functional groups at at least one terminal, as essential components, wherein the content of the component (C) is 50 to 150 wt.% based on the total amount of the components (A) and (B). COPYRIGHT: (C)2006,JPO&NCIPI |
