METHOD OF SEALING WITH RESIN

摘要

PROBLEM TO BE SOLVED: To provide a method of sealing with a resin including the steps of regulating and supplying the amount of a sealing resin to be supplied to a work in which a plurality of semiconductor chips are laminated on a substrate according to the laminated state of the semiconductor chips. SOLUTION: The method of sealing with the resin includes a step of keeping the volume in memory relative to the amount of resin supplementation of the semiconductor chip 2; a step of measuring a Z-axis height from the substrate side of the semiconductor chip 2 laminated on a work W to the chip of the uppermost side; a step of judging the amount of the chip laminations from the Z-axis height measurement value, and calculating the amount of resin or the amount of the resin supplemented to the semiconductor chip 2 running short or the amount of the resin which is not supplemented; a step of directing the amount of the resin supplemented or the amount of the resin not supplemented as control data to a resin supply unit 6; and a step of accumulating the control data on every work W and supplying the sealing resin from the resin supply unit 6 to the work W. COPYRIGHT: (C)2006,JPO&NCIPI