| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an insulating resin film for a printed wiring board having gas barrier characteristics which has adhesiveness to a base material at complete hardening even if no adhesive layer is provided, and to provide the printed wiring board using it. <P>SOLUTION: At least one gas barrier layer 21 is provided on an insulating resin layer 11 of semi-hardened condition by a chemical vapor deposition. The thickness of the gas barrier layer is 10-3,000Å, and the vapor permeation degree of the gas barrier layer is 5.0 g/(m<SP>2</SP>24 hours) or less. The insulating resin layer 11 of the semi-hardened condition comprises an epoxy resin (A), a hardening agent (B), and a reinforcing material (C); and the hardening agent (B) is made of phenol resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
