| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a printed circuit board in which primarily, flexibility and flexuosity are excellent, secondarily, lightweightness and ultrathinning can be realized and densification and microfabrication can be also realized, thirdly, processes are more simplified to reduce a cost, and fourthly, accuracy or the like is improved. SOLUTION: In the method, a number of through-holes 5 are first provided, and conductive treatment is performed on internal sides of the holes 5 in a substrate 3 in which a copper foil 2 is each attached to both sides of an insulating material 1. Next, after one side of the substrate 3 is covered with a photosensitive dry film 16 provided with a masking outer layer 17, a developer is impregnated in the holes 5 from an opposite side, thereby developing the film 16 as a plating resist. Thereafter, the film 16 is cured by exposure, the layer 17 is next removed, and electrolytic copper plating 6 is performed on internal sides of the holes 5 or the like. A circuit pattern 7 is formed after the film 16 is removed. COPYRIGHT: (C)2006,JPO&NCIPI |
