| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for cutting a substrate using a femtosecond laser which generates no thermal expansion nor impulse wave in the periphery of a spot wherein the substrate is cut and thereby reduces wear and tear expenses. <P>SOLUTION: This method for cutting the substrate using the femtosecond laser comprises a step for arranging a substrate 100 on a stage and a step for projecting the femtosecond laser 201 to a portion to be cut of the substrate arranged on the stage and cutting the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
