发明名称 METHOD OF MANUFACTURING FILM BASE MEMBER FOR WIRING BOARD AND FLEXIBLE PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a film base member for a wiring board, which is suitable for high definition and high frequency application and which employs liquid crystal polymer (LCP) for the base member. SOLUTION: A CF silane coated film 111 is formed, in which the surface of a resin film 11 made of liquid crystal polymer (LCP) is activated using carbofunctional silane. Thereafter, a metal film 12 is formed on the resin film 11 with the aid of electroless plating processing, and then heating processing at temperature 200°C for about 30 min is performed to manufacture a film base member 10 for a wiring board improved in adhesion between the resin film 11 and the metal film 12. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006135179(A) 申请公布日期 2006.05.25
申请号 JP20040324024 申请日期 2004.11.08
申请人 HITACHI MAXELL LTD 发明人 FUKAO RYUZO
分类号 H05K3/00;B32B15/08;C23C18/16;C23C18/20;C23C18/30;C25D5/56;C25D7/00;H05K3/18 主分类号 H05K3/00
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