| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board wherein a fine circuit pattern is achieved using "additive method" or "semi-additive method" and the variation in the height (thickness) of the circuit pattern is sufficiently suppressed. SOLUTION: In the printed wiring board wherein the circuit pattern 2 consisting of an electrically conductive material is formed by plating on an insulating substrate 1, dummy circuit regions are formed on both sides or in the surrounding portion of a component mounting region in the circuit pattern 2. Further, preferably the conductor pattern in the dummy circuit regions has the same shape as the conductor pattern forming the circuit pattern 2 in the component mounting region. COPYRIGHT: (C)2006,JPO&NCIPI
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