发明名称 SUBSTRATE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate in which a pattern that is relatively wide and has a large film thickness can be formed by a liquid-drop discharge method. SOLUTION: The manufacturing method manufactures a substrate (10) having a patterned functional film. The method comprises the steps of forming a groove pattern (12) on the substrate (10) by laser irradiation (11), disposing a liquid material (13) along the groove pattern (12), and heating the liquid material (13) to form the functional film. In addition, the groove pattern (12) may be combined with a liquid-repellent film (14). The liquid material can be used to form a high-density fine functional film (e.g. wiring pattern) on the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006135090(A) 申请公布日期 2006.05.25
申请号 JP20040322619 申请日期 2004.11.05
申请人 SEIKO EPSON CORP 发明人 UMETSU KAZUNARI
分类号 H05K3/10;G09F9/00;H01L51/50;H05B33/02;H05B33/10;H05K3/28 主分类号 H05K3/10
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