| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor inspection device capable of previously detecting a semiconductor apparatus equipped with bumps in irregular shape. SOLUTION: The semiconductor inspection device is equipped with a probe card 14 which is connected to a projection 2a provided to the semiconductor apparatus to input inspection signals to the semiconductor apparatus, a laser range finder 12 which measures the height of the projection 2a, and a calculation control unit 16 which determines whether the height of the projection 2a stays out of a standard range or not by comparing the height of the projection 2a measured by the laser range finder 12 with the standard range of the height of the projection 2a. The calculation control unit 16 controls the movement of a wafer chuck 10b so as to prevent the probe card 14 from being connected to the semiconductor apparatus equipped with the projection 2a whose height is out of the standard range. COPYRIGHT: (C)2006,JPO&NCIPI
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