SEMICONDUCTOR MODULE AND ITS MANUFACTURING METHOD, AND FILM INTERPOSER

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor module in which a fine pitch connection technology is used.

SOLUTION: The semiconductor module includes a semiconductor element having a principal surface in which an element electrode is formed; and a film member having an insulating resin layer which has a front surface and a rear surface, and a wiring pattern formed on the rear surface of the insulating resin layer. The semiconductor element and the film member are superposed so that the main surface of the semiconductor element is brought into contact with the front surface of the film member, and the part of the wiring pattern of the film member is brought into contact with the element electrode of the semiconductor element through the insulating resin layer.

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