| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, having a high flame retardance without using a flame retardance-imparting agent, and also excellent in solder reflow resistance, and a semiconductor device obtained by sealing a semiconductor element by using the same. SOLUTION: This epoxy resin composition for sealing the semiconductor is characterized by using (A) a phenol aralkyl type epoxy resin having a phenylene skeleton, (B) a phenol aralkyl type phenol resin having a biphenylene skeleton, (C) a curing accelerator, (D) an inorganic filler and (E) a triazole-based compound as essential components, and containing≥84 wt.% and≤92 wt.% (D) inorganic filler based on the total epoxy resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
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