| 发明名称 |
HIGH SURFACE AREA ALUMINUM BOND PAD FOR THROUGH-WAFER CONNECTIONS TO AN ELECTRONIC PACKAGE |
| 摘要 |
A bond pad for effecting through-wafer connections to an integrated circuit or electronic package and method of producing thereof. The bond pad includes a high surface area aluminum bond pad in order to resultingly obtain a highly reliable, low resistance connection between bond pad and electrical leads.
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| 申请公布号 |
US2006110905(A1) |
申请公布日期 |
2006.05.25 |
| 申请号 |
US20040904677 |
申请日期 |
2004.11.23 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ADKISSON JAMES W.;GAMBINO JEFFREY P.;JAFFE MARK D.;RASSEL RICHARD J.;SPROGIS EDMUND J. |
| 分类号 |
H01L21/44;H01L21/50 |
主分类号 |
H01L21/44 |
| 代理机构 |
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