发明名称 RESIN MOLDING SYSTEM AND RESIN MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin molding system which can simultaneously heat, pressurize, and mold at least two resin moldings between heating/molding plates without using a large-scale press and a resin molding method. SOLUTION: The resin molding system 11 for molding at least two resin moldings S2 simultaneously between the at least three piled heating/molding plates 14 is provided with a resin molding press 12 for molding the resin moldings S2 simultaneously between the heating/molding plates 14, a molding plate opening/closing apparatus 13 for opening/closing the piled heating/molding plates 14 outside the press 12, and moving apparatus 15 for moving the piled heating/molding plates 14 between the press 12 and the molding plate opening/closing apparatus 13. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006130785(A) 申请公布日期 2006.05.25
申请号 JP20040322511 申请日期 2004.11.05
申请人 MEIKI CO LTD 发明人 KOYAMA HIRONORI
分类号 B29C43/36;B29C43/02;B29C43/32;B30B15/34 主分类号 B29C43/36
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