发明名称 Hot embossing lithography method
摘要 A hot embossing lithography method includes the steps of: providing a press mold ( 20 ) having a press surface, the press surface having a pattern defined therein; providing a substrate ( 10 ') having a polymer thin film ( 30 ) formed thereon; aligning the press mold with the polymer thin film; introducing a vapor to moisten the press surface for lowering a surface adsorption energy of the press surface; heating the polymer thin film to a temperature above a glass transition temperature of the polymer thin film, thereby softening the polymer thin film; pressing the press mold into the softened polymer thin film to transfer the pattern of the press mold into the polymer thin film; cooling the polymer thin film and the press mold to a temperature near the glass transition temperature of the polymer thin film; and separating the press mold from the polymer thin film.
申请公布号 US2006108711(A1) 申请公布日期 2006.05.25
申请号 US20050240199 申请日期 2005.09.30
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 YU TAI-CHERNG
分类号 B29C59/02 主分类号 B29C59/02
代理机构 代理人
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