Semiconductor wafer`s alignment marks finding method for e.g. dynamic RAM, involves imaging marks and structures on photoresist of wafer by imaging device, and measuring real position of marks relative to reference system of device

摘要

The method involves providing a photoresist on a layer of a semiconductor wafer (2), and aligning the wafer by an aligning unit (11) of an imaging device e.g. optical microscope. The wafer is dynamically focused, and the alignment marks and structures are imaged on the photoresist by the device. Real position of the marks is measured relative to a reference system of the device and the position data are transfered to another device.