发明名称 |
Method and apparatus for removing particles from a surface of an article |
摘要 |
<p>A method and an apparatus for removing particles from a surface of an article, such as a semiconductor wafer in a clean room, are disclosed. The particles are supplied with an electric charge. Subsequently, an ultrasonic wave or a gas stream is applied onto the surface of the article while an electric field is applied for driving away the electrically charged particles from the surface, thereby removing particles having a dimension smaller than 1 micrometer from the surface. The presence of a collecting member allows the removal of resulting, floating particles. <IMAGE></p> |
申请公布号 |
EP0840357(B1) |
申请公布日期 |
2006.05.24 |
申请号 |
EP19970119341 |
申请日期 |
1997.11.05 |
申请人 |
EBARA CORPORATION |
发明人 |
FUJII,TOSHIAKI;OKUYAMA, KIKUO;SHIMADA, MANABU |
分类号 |
H01L21/00;B03C3/38;B03C3/43;B08B3/10;B08B6/00;B08B7/00;H01L21/306;H05F3/06 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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