Cooling and/or conditioning wafer during manufacture of optical data media involves inserting holding pin into wafer inner hole, deflecting gas stream to wafer underside that holds it floating on gas cushion during cooling/conditioning

摘要

The method involves inserting a holding pin into the inner hole of a wafer (155) and deflecting a gas stream to at least one underside of the wafer that holds it floating on a gas cushion during cooling and/or conditioning. At least one gas stream directed at the wafer rotates it while the holding pin provides lateral guidance and transport of the wafer. An independent claim is also included for an arrangement for cooling and/or conditioning a wafer with an internal hole during manufacture of optical data media.