发明名称 Contact between a component and a busbar grid
摘要 <p>The lead frame has conductor regions (2) and contact pads for electrically connecting a component (6,7,8). The lead frame has a mounting region (5) for electrically contacting and mechanical fixing of the component (8) to the lead frame. The mounting region is preferably basket-shaped, and exerts force on an inserted component.</p>
申请公布号 EP1659837(A1) 申请公布日期 2006.05.24
申请号 EP20050023091 申请日期 2005.10.22
申请人 HIRSCHMANN AUTOMOTIVE GMBH 发明人 KREUTER, MARKUS;SCHMID, MARTIN
分类号 H05K1/00;H01R9/22;H01R9/24;H05K3/32 主分类号 H05K1/00
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