| 摘要 |
A porous-material-forming photo-curing resin composition comprising: a photo-polymerizable monomer (A) having a surface tension of not more than 25 x 10<-5> N/cm, an organic compound (B) that is non-compatible with the photo-polymerizable monomer (A), a common solvent (C) that is compatible with the photo-polymerizable monomer (A) and the organic compound (B); and a photo-polymerization initiator (D); and a porous resin cured product which is obtained by photo-curing the above composition and has a very low surface tension. |
