| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing the same are provided to reduce a total size of a chip and improve a heat-sink function of a semiconductor package by changing a structure of the semiconductor package. CONSTITUTION: A multitude of input/output pad(4) is formed on an upper face of the first semiconductor chip(2). A multitude of input/output pad(8) is formed on an upper face of the second semiconductor chip(6). The second semiconductor chip(6) has a smaller size than the first semiconductor chip(2). The second semiconductor chip(6) is formed on an upper face of the first semiconductor chip(2). One end of a conductive wire(10) is bonded with the input/output pads(4,8) of the first and the second semiconductor chips(2,6). The other end of the conductive wire(10) is extended to an upper direction. A sealing material(12) is adhered on upper portions of the first and the second semiconductor chips(2,6). |
