| 摘要 |
A thermosetting resin composition of this invention contains 100 parts by weight of composition (E), 0.01 to 20 parts by weight of a cationic polymerization initiator (C), and, where necessary, 50 parts by weight or less of an epoxy-containing acrylic resin (D), the composition (E) contains 10 to 99 percent by weight of an ester-free alicyclic epoxy compound (A), and 90 to 1 percent by weight of an epoxy compound (B) differing from (A). A cured article thereof is excellent in heat resistance, dimensional stability, and optical transparency and can be used as a replacement for glass substrates.
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