发明名称 |
Method of manufacture of ceramic composite wiring structures for semiconductor devices |
摘要 |
Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.
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申请公布号 |
US7047637(B2) |
申请公布日期 |
2006.05.23 |
申请号 |
US20040824723 |
申请日期 |
2004.04.15 |
申请人 |
DEROCHEMONT L PIERRE;FARMER PETER H |
发明人 |
DEROCHEMONT L. PIERRE;FARMER PETER H. |
分类号 |
H01R43/00;B32B15/00;H01L21/48;H01L23/14;H01L23/367;H01L23/373;H01L23/498;H01L23/64;H05K1/02;H05K1/03;H05K3/00;H05K3/38;H05K13/00 |
主分类号 |
H01R43/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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