发明名称 |
Method of manufacturing mounting substrate and surface mount crystal oscillator |
摘要 |
A method of manufacturing a mounting substrate accommodating therein an electronic component for use in a surface mount crystal oscillator and adapted to be joined to a bottom surface of a crystal unit has the steps of defining a recess with a bottom wall and a frame wall having an opening, placing the electronic component in the recess, filling the recess with a resin for protecting the electronic component, and, after the resin is cured, removing at least a portion of the frame wall. The electronic component typically comprises an IC (Integrated Circuit) chip incorporating an integrated oscillating circuit that employs a crystal unit.
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申请公布号 |
US7049174(B2) |
申请公布日期 |
2006.05.23 |
申请号 |
US20030661978 |
申请日期 |
2003.09.11 |
申请人 |
NIHON DEMPA KOGYO CO., LTD. |
发明人 |
SAKABA YASUO;NISHIWAKI MASAKAZU |
分类号 |
H01L21/44;H01L21/56;G04F5/06;H01L21/48;H01L21/50;H03B5/32;H03H9/05 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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