| 摘要 |
<p>The invention relates to an arrangement which is used to increase the density of the components of a printed circuit board (1) comprising electric components (2) which can be mounted on the surface. The printed circuit board (1) is formed by two films (3x, 3y) which are pressed against each other and comprises a dielectric (4) which is disposed therebetween. At least one of the of the opposite sides (3a, 3b) of the films (3x, 3y) is fitted with electric components (2) which can be mounted on the surface. According to the invention, holes (6b), which are used to connect both films (3x, 3y) (3x, 3y) in the printed circuit board (1), are provided and each of the holes (6b) is a direct connection of said opposite sides (3a, 3b) of the films (3x, 3y).</p> |
